More

        

          

    HomeNewsTelefónica teams up with MediaTek to broaden Labs programme

    Telefónica teams up with MediaTek to broaden Labs programme

    -

    Telefónica’s Labs innovation programme is taking place outside of Spain for the first time, with the operator working with MediaTek to develop Internet of Things and wearable solutions.

    The partnership with the semiconductor manufacturer will involve 10 engineering students from Spanish universities working in MediaTek’s research and development offices in the UK city of Cambridge from September to December this year.

    The engineers will work on new proof-of-concepts for IoT and wearable devices using MediaTek’s LinkIt development platforms. They will also build Android applications by using MediaTek’s SDK, conduct testing and technology benchmarking, as well as create digital content in Spanish and English.

    Labs is part of the Spanish operator’s Talentum Startups programme, which aims to develop young talent by getting them to explore new technologies.

    MediaTek’s own Labs initiative has also fostered the development of new products, including the likes of fitness trackers, smart watches and smart light bulbs.

    Carlos López Blanco, Global Head of Public Affairs and Regulation, Telefónica, said: “Since their inception in 2014, more than 15 projects have been carried out through the Labs initiative with 150 high-potential students participating in them. MediaTek’s participation in the program will allow Labs to extend the international reach of the program and expose more students to international work experience and technology innovation.”

    Marc Naddell, Vice President of MediaTek Labs, added: “MediaTek Labs believes that students are one of the groups at the forefront of emerging technology innovation and an important source of entrepreneurship. In collaboration with Telefónica, we are excited to support the next generation of creative and driven pioneers to work on interesting new prototype devices and applications using MediaTek technologies.”