Intel has demonstrated its new low-cost System on Chip (SoC) architecture, which it is aiming at the Chinese 3G market, for the first time.
The SoFIA family of integrated mobile SoC was first announced earlier this year. System on chip products put all of the necessary parts for a system onto a single integrated circuit.
Intel has predicted the product will be used in entry-level smartphones and tablets, with the 3G platform expected to launch by 2015.
The announcement was made in China, where the company launched a new smart device innovation centre in Shenzhen. Intel also made the first live call using its LTE Category 6 enabled XMM7260 platform, which supports the TD-LTE and TD-SCDMA protocols that are needed for the Chinese market. The vendor is currently working on certification for the product, which is expected to be available commercially in the second half of this year.
The US-based company also launched a new platform to help enterprises take advantage of the internet of things. Intel’s Gateway Solutions for IoT uses its Quark and Atom processors, as well as a development platform based on its Galileo software. The platform include software from Wind River, which will provide security, smart connectivity and device managements, as well as software from McAfee, which safeguards against malware.
Among the companies that are already using the platform are Shaspa, in energy and building automation, RocKontrol for energy management, TransWiseway and Vnomics for transportation, and Zebra Technologies for retail, health and manufacturing solutions.
According to IDC, the Internet of Things will include 50 billion units by 2020. Earlier this week, Intel signed up to a US-based consortium that will work on driving standards and adoption of the technology.